Introduction to Angular
Exercise 1

Introduction to TypeScript
Exercise 2

Angular basics
Exercise 3

Day 1

Power Amplifier Basics and Signal Environments

Linear amplifier modes are described with quantitative analysis of power, efficiency and linearity tradeoffs in uncompensated form leading into a discussion of the device technologies currently available for PA design, including LDMOS, GaAs MESFET and HBT, SiC and GaN. Differences between bipolar and FET devices, and the effects of different kinds of parasitic effects will be discussed using circuit analysis and CAD models. Possibilities for tailoring the characteristics of devices for optimum efficiency and linearity will be presented. Particular emphasis is given to correct fundamental and harmonic matching. The impact of non-ideal harmonic terminations in practical Class AB designs will be analysed quantitatively. Various modulation systems (QPSK, EDGE, CDMA, OFDM) will be reviewed from the viewpoint of PA requirements. 

• Introduction
• Classical PA Modes, Class A, Class AB, Class B, Class C
• PA Device Technology
• Optimum Device Characteristics for Class AB Operation
• Modulation Systems in Wireless Communications QPSK, GSM, EDGE, OFDM
• Effect of Signal Environment on RFPA Design

Day 2

Class AB PA Design

We will focus on practical issues in the design and manufacture of PAs for RF and MW Systems. Several design examples will be demonstrated, including a GaAs MESFET, a GaAs HBT, and a high power LDMOS device.

• Class AB circuits
• Harmonic Terminations
• CAD Design Examples

Day 3

Power Amplifier Non-Linearity and Signal Environments

We will focus on the non-linear properties of RF PAs, their source, manifestation, and methods for their characterization and modeling. A topical issue of great impact in modern linearised multi-carrier PA (MCPA) applications is memory effects.This subject will be illustrated with device measurements, and physical causes and remedies will be discussed.

There will be a full treatment of bias network design.The process of converting a measured PA gain compression and AM-PM characteristic into spectral and EVM distortion, and the issues involved, will be discussed using several different modulation environments, including GSM-EDGE and WCDMA.

• Non-Linear PA Characteristics, Gain Compression, AM-PM
• Physical Origins of AM-PM, Analysis
• Peak to Average Power Ratio Issues in Modern Signal Environments
• Spectral Regrowth and EVM
• Power Series, Volterra Series. Model Fitting using Measured Data
• Envelope Simulation using EDGE, OFDM signals
• Memory Effects, Definition, Dynamic Gain/Phase Measurements, Causes and Remedies
• Bias Network Design and Stability

Day 4

Efficiency Enhancement Techniques

We will focus on the key issue of power back-off (PBO) efficiency, and LINC (linear amplification using non-linear components). Envelope management methods and tracking techniques in PA design will be presented. These include classical techniques such as the Chireix out-phasing method, the Khan and the Polar Loop envelope reconstruction approaches and the Doherty PA. Other less well-known techniques will be discussed, with emphasis on the broader band requirements, which future WiMax systems will require. Ultra high efficiency amplifier modes, Classes C, D, E, and F will be analyzed as possible candidates for LINC implementation and as stand-alone possibilities in systems using digital pre-distortion or feed forward linearization. Finally, PA architecture, including multistage effects, power combining techniques, and load pull design will be discussed. Step-by-step examples of two MMIC PA designs, one with modest, and a further example with wideband operation will be given – this will include technology evaluation to packaging considerations.

• Power Combining Techniques
• Balanced and Push-Pull Operation
• Load-Pull Techniques
• Microwave PA Design – including step-by-step MMIC PA design examples

Day 5

An introduction to mm-wave components and applications

mm-wave circuits are becoming more commonplace as semiconductor technologies mature which provide performance up to 100 GHz and beyond. This Session will offer an introduction to the technologies and components operating at mm-wave and some of the key applications. Amplifier design at mm-wave will be discussed with a design example. Differences in the approach of amplifier design at mm-wave compared to lower frequency will be highlighted. In addition, an introduction will be given for other common component types at mm-wave: mixers, multipliers, oscillators and mixed (analogue/digital) signal techniques. Packaging, interconnection and combining will also be considered. Finally, the emerging field of sub-mm-wave (Terahertz) components will be introduced.

• Applications in mm-wave
• mm-wave technologies
• Amplifiers – including a design example
• Common mm-wave components
• Packaging at mm-wave
• Terahertz