Course 060 Grounding and Shielding: The Essence of EMC Design

Mr. Elya B. Joffe, Electromagnetic Solutions Ltd., Israel, is teaching this 3-day course about Transients and Electrical Overstress Protection. Modern electronics are extremely vulnerable to electrical transients and overstress, which are “predictably unpredictable”. Protection measures can be designed and implemented, are available, but many businesses are not aware of the threat and/or not willing to invest the time or money: There is a prevailing “It Can’t Happen” attitude. This course will provide the engineering know-how, to describe transient protection and mitigation techniques and to provide the technical tools enabling the engineer to analyze the vulnerability of equipment and design protection of product, systems and facilities, to transients and electrical overstress in electronic circuits and installations, in order to meet the applicable standards and codes

Available course dates

This course has no planned course dates.

If you are interested in this course, contact us at cei@cei.se

EMC, SI, PI.

060 Grounding and Shielding: The Essence of EMC Design

Location: Barcelona, Spain Date: April 13-16, 2026 Duration: 4 days
Instructor: Mr. Elya B. Joffe. Modern electronics are extremely vulnerable to electrical transients and overstress, which are “predictably unpredictable”. Protection measures can be designed and implemented, are available, but many businesses are not aware of the threat and/or not willing to invest the time or money: There is a prevailing “It Can’t Happen” attitude. This 4-day course will provide the engineering know-how, to describe transient protection and mitigation techniques and to provide the technical tools enabling the engineer to analyze the vulnerability of equipment and design protection of product, systems and facilities, to transients and electrical overstress in electronic circuits and installations, in order to meet the applicable standards and codes. Read full course description including course schedule.

Early Bird
2 940,00 3 265,00 
Early Bird Price Ends: February 13, 2026

TECHNOLOGY FOCUS

The discipline of Electromagnetic Compatibility (EMC) is concerned with the design of Electronic Systems, while minimizing electromagnetic coupling and interference from within the system and between systems to their environment.

Meeting the strict EMC standards, as well as ensuring the satisfactory performance of the equipment in its intended electromagnetic environment, requires the implementation of technical measures into the system’s design.

Grounding forms an inseparable part of all electronic and electrical designs, from circuit through system up to installation design. Grounding is implemented for EMC and ESD protection, for safety purposes, for lightning and surge protection.

Shielding, on the other hand, is a necessity for avoiding electromagnetic field coupling from and into equipment enclosure. Adequate shielding is necessary to enhance immunity of equipment, and reduce emissions from the equipment enclosure.

Grounding and shielding are two of the essential concepts in EMC design. No design will be acceptable without them being properly implemented.

Instructor

Mr. Elya B. Joffe

COURSE CONTENT

This is an advanced design course, dealing with the theory and practices of grounding and shielding for meeting EMC objectives.

The course features understanding of the electromagnetic phenomena related to electronic equipment and system-level grounding and shielding. The course covers the grounding and its topologies, leading to the implementation of grounding from circuit to system. With respect to shielding, the course will cover issues such as the shielding properties of metals, and the compromises in shielding, which are the main objective of shield design.

Case studies and practical “real life” examples will be provided.

WHO SHOULD ATTEND

The Course is intended for electrical, electronic and computer and process control engineers, who are involved in the design and development, qualification or engineering management of electronic and electrical equipment and systems for government, industrial, commercial, aviation and other applications. In particular – the Course is intended for Engineers involved in the design of power and communication systems, or equipment connected to such networks, thereby exposed to transients, e.g. lightning-induced surges and other sources.

Benefit to the Participants

Participants in the Course will

  • obtain fundamental knowledge of the electrical transient and overstress phenomena and their effects
  • gain knowledge on transient specifications and standards, and the application of the standards
  • learn how to estimate or derive the susceptibility levels of electrical and electronic circuits to transients and electrical overstress
  • study the characteristics of basic protection devices, and obtain the knowledge to design advanced topologies of protection circuits

In addition, participants are encouraged to bring forward actual design problems and questions they encountered, which the instructor will attempt to assist in their solution.

Day 1

Fundamental Concepts

  • Basic concepts of EMI phenomena and EMC and the primary parameters that govern interference modes and system performance with respect to EMC
  • A video presentation, “EMI: The Silent Threat”

Signals and Coupling Modes

  • Characteristics of signals, in particular their spectral content
  • Concepts of common-mode vs. differential-mode signals, particularly with their effect of EMI interactions
  • Fundamental field concepts, with special emphasis on magnetic field interactions
  • Manner of signal propagation in circuits and systems
  • Concept whereby current follows the “path of least impedance” and the implications of this concept
  • Transmission line fundamentals and frequency considerations

Circuit Elements

  • Characteristics of real world circuit elements, with special emphasis on parasitic inductance, capacitance and resistance

Fundamentals of Grounding Design

  • Concept of grounding, and basics of grounding system designs
  • Reasons and rationale for grounding and conflicts between grounding and other system requirements (e.g., safety considerations)

Grounding Essentials

  • Fundamental grounding topologies
  • Structured methodology for the design of the grounding tree

Day 2

Ground-Loop Interaction and Coupling (GLIC)

  • Concepts (and myths) associated with “ground loops”
  • Common to differential mode conversion phenomenon, consequent of ground loops
  • Mitigation techniques of ground loop generated interference such as isolation transformer, Baluns, optocouplers, and other

Equipment and System-Level Grounding

  • Dilemma associated with interconnects between large scale systems and installations
  • Application of the fundamental grounding theory to different tiers of equipment and systems
  • Interconnection of multiple ground connections

Implementation of Grounding on Printed Circuit Boards

  • Objectives of grounding on PCBs, including those of signal current return and signal reference
  • Implementation of grounding for each of the objectives
  • Concepts of power distribution and transmission line signal propagation on PCBs and the role of the grounding system in their implementation
  • Mixed analog/digital circuits and approaches for grounding to be applied, particularly when analog-to-digital (A/D) and digital-to-analog (D/A) converters are incorporated in the circuit
  • Special considerations of grounding in PCBs, including moats and ground fills and chassis stitching

Day 3

Cable Shielding and Shield Termination

  • Basics of field to cable interaction and one of the solutions, in the form of cable shielding
  • “How should the cable shield be grounded, at one or both ends?”
  • A comparison of signal circuit wiring grounding vs. shield grounding, and the fundamental difference between the two

Bonding

  • Manner of achieving high-quality electrical connection
  • Bonding as a link between grounding and shielding, and techniques for achieving acceptable bonds
  • Dissimilar metals and metal electrochemical compatibility between bonded structures
  • Manner for corrosion control

Fundamental Shielding Theory

  • Fundamentals of equipment shielding and mechanisms contributing to the shielding effectiveness of an enclosure
  • Significance, limitations and the factors contributing to reflection and absorption mechanisms
  • Unique approaches to shielding against low-frequency magnetic fields

Day 4

Shield Discontinuities and Their Treatment

  • Effects of discontinuities in shielding materials, and solutions to aperture and slot leakage
  • EMI gaskets and their application

Equipment and System Shielding Design

  • Implementation of shielding to equipment external and internal (partitioning) shielding
  • Application of shielding at the equipment rack and console levels
  • Implementation of shielding on the PCBs (“shield cans”)

Shield Integrity Violations

  • Manners of undesirable (yet common) violations of the shielding integrity, including shield penetrations and discontinuities
  • Manners and materials available for preclusion of such violations

Grounding and Shielding Related Case Studies

  • Real-life grounding and shielding case studies
  • The participants will also be encouraged to share their own case studies at this time.

ALL COURSE DATES FOR THE CATEGORY:

EMC, SI, PI.

054 Signal and Power Integrity: Advanced High-Speed Design and Characterization

Location: Barcelona, Spain Date: April 13-17, 2026 Duration: 5 days
Instructor: Dr. István Novák. With machine learning and artificial intelligence needs on the rise, the thousands of amperes currents on some of the power rails create unique challenges across our designs, manufacturing and validation. Properly designed power distribution is a key requirement to achieve good signal integrity and to avoid electro-magnetic interference problems. As companies are working towards data rates over 400 Gbps and main-stream serial signaling is in the 5-10 Gbps range; signal rise and fall times shrink to single digit picoseconds. As a result of these signal and power integrity trends, laminate and copper characteristics, glass-weave effects and surface roughness, frequency-dependent trace and component parameters, inter-symbol interference (ISI), jitter and finite bit-error-rate (BER) all need to be re-evaluated and reconsidered. With the increasing utilization of equalization and pre-emphasis, validations even with eye diagrams may not be sufficient. Today, equally challenging is the proper design of power distribution. A multitude of supply voltages, shrinking target impedance values approaching tens of microohms and higher channel attenuations come with reduced timing and noise margins. The allowed noise on signals and on supply rails decreases and the increasing density and bandwidth of interconnects inter-link the previously independent power-integrity, signal-integrity and EMC design domains. Also, the mere definition of impedance on a power rail with tens of microohms impedance becomes non-trivial. Read full course description including course schedule.

Early Bird
3 540,00 3 935,00 
Early Bird Price Ends: February 13, 2026

EMC, SI, PI.

060 Grounding and Shielding: The Essence of EMC Design

Location: Barcelona, Spain Date: April 13-16, 2026 Duration: 4 days
Instructor: Mr. Elya B. Joffe. Modern electronics are extremely vulnerable to electrical transients and overstress, which are “predictably unpredictable”. Protection measures can be designed and implemented, are available, but many businesses are not aware of the threat and/or not willing to invest the time or money: There is a prevailing “It Can’t Happen” attitude. This 4-day course will provide the engineering know-how, to describe transient protection and mitigation techniques and to provide the technical tools enabling the engineer to analyze the vulnerability of equipment and design protection of product, systems and facilities, to transients and electrical overstress in electronic circuits and installations, in order to meet the applicable standards and codes. Read full course description including course schedule.

Early Bird
2 940,00 3 265,00 
Early Bird Price Ends: February 13, 2026

EMC, SI, PI.

070 High-Speed PCB Design for EMC and Signal Integrity

Location: Gothenburg, Sweden Date: June 22 - June 26, 2026 Duration: 5 days
Instructor: Mr. Elya B. Joffe. All EMI problems begin and end on the Printed Circuit Board. In recent years, PCBs have become increasingly complex. The use of high density VLSI on the one hand, combined with the increased processing speed and data rates on the other hand, have led to the increased density of the circuits. The use of high speed/high edge rate digital circuits, along with the need for low power consumption, have contributed to higher electromagnetic emissions from circuits, on the one hand, and increased sensitivity of the circuits on the other, leading to Electromagnetic Interference (EMI) problems. A special problem is that of Signal Integrity (SI). For the adequate control of EMI, strict international standards and regulations have been developed worldwide. These standards require the suppression of electromagnetic emissions from circuits and systems, and their increased immunity to externally induced interference. The proper design of PCBs is a cost effective approach for the control of EMI in high-speed circuits. Read full course description including course schedule.

Early Bird
3 540,00 3 935,00 
Early Bird Price Ends: April 22, 2026

EMC, SI, PI.

071 Transients and Electrical Overstress Protection in Electronic Systems

Location: Amersfoort, The Netherlands Date: May 18 - May 20, 2026 Duration: 3 days
Instructor: Mr. Elya B. Joffe. Modern electronics are extremely vulnerable to electrical transients and overstress, which are “predictably unpredictable”. Protection measures can be designed and implemented, are available, but many businesses are not aware of the threat and/or not willing to invest the time or money: There is a prevailing “It Can’t Happen” attitude. This 3-day course will provide the engineering know-how, to describe transient protection and mitigation techniques and to provide the technical tools enabling the engineer to analyze the vulnerability of equipment and design protection of product, systems and facilities, to transients and electrical overstress in electronic circuits and installations, in order to meet the applicable standards and codes. Read full course description including course schedule.

Early Bird
2 280,00 2 535,00 
Early Bird Price Ends: March 18, 2026

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