Course 064 LiDAR Sensors from System to Transistor/Device Level and Miniaturization through ASIC and (Co-)Packaging
Dr. Farzad Parsaie, founder of SAND Microsystems GmbH, Switzerland is teaching
this 5-day course on LiDAR Sensors.
LiDAR, that stands for Light Detection and Ranging or simply Light Radar, has already been known for decades and used in different areas as meteorology and space. Recently more attention and interest has been devoted to LiDAR to detect objects for plenty of new applications as autonomous driving (AD), advanced driver assistance systems (ADAS), drones, robots, 3D Imaging and scanning, etc.
However, the conventional LiDAR instruments in use have been quite bulky and very expensive. This has strongly limited the usage of this sensor so far. Over 100 companies are working on the development of new LiDAR solutions that can be used for many product applications mentioned above.
This course enables Engineers and Managers to become familiar with different concepts that a LiDAR sensor can be realized from the top system level down to the transistor and device level. It is planned to raise the awareness of the participants about the challenges and the development issues of LiDAR by proposing several solutions that can help to minimize the development risks and time.
After introduction and comparison of architectures details of Electronic and Optoelectronic components and subsystems will be covered. Advanced techniques and technologies will be introduced that enable us to minimize the size and cost of LiDAR tremendously.
Available course dates
This course has no planned course dates.
If you are interested in this course, contact us at cei@cei.se
TECHNOLOGY FOCUS
LiDAR is a sensor that measures distance with light and can be used to detect obstacles for vehicles and robots or to scan buildings.
Over 100 companies are working to develop LiDAR solutions that can bring the required high performance and are more economic in terms of costs and much smaller for better integration in vehicles, robots, and drones so that they can be easily portable.
COURSE CONTENT
This course provides an overview of different LiDAR architectures in their use cases. Examples are Time of Flight (ToF) and FMCW techniques, where light can be scanned over the scene or illuminate the whole field of view with a flash.
The advantages and challenges of each case will be discussed in detail. The course will focus from System level to Transistor and Device level on all Electronic and Optoelectronic components and subsystems. Advanced discrete and integrated techniques and technologies like Analog/RF-Frontend topologies, Discriminator, ADC, ASIC process technology (CMOS, BiCMOS), (Co-) Packaging, different devices like Photodetectors and Laser Diodes as well as switches, switch drivers and power management techniques will be addressed extensively.
Solutions for miniaturization of novel LiDAR products through ASIC integration and (Co-) packaging will be shown with the goal how to reduce costs and improve performance.
WHO SHOULD ATTEND
This is a course about the development of LiDAR as a multi-disciplinary product, hence of interest for technical staff of different disciplines. They need to understand details and consider optimization on the higher product level and not only locally on a single discipline level. In general, it will be of interest to:
– Engineers, Physicists, Scientists, technical staff, and Students
– System Architects, Project Managers and Technical Managers
– Business Development Managers, Marketing Managers, who plan to be involved in specification and development of such a multi-disciplinary optoelectronic product and want to do business with it with fast Time to Market.
Daily Schedule
Day 1
Overview LiDAR and Architectures
- Introduction LiDAR
- Time of Flight (ToF) LiDAR, Flash and scanning LiDAR
- AMCW, FMCW, FM Comb LiDAR
- What is a solid-state LiDAR?
- Light wavelength and Power, Eye Safety
Day 2
The Optical Receive Channel
Part1: Photodetectors
- Introduction of discrete and integrated Photodetectors
- Physical Principles and Technologies
- Light power and wavelength sensitivity, materials
- Noise sources, sensitivity, and speed
Day 3
The Optical Receive Channel
Part2: Electronic Interface and Signal Conditioning
- Low noise and high-speed electronic Interfacing of Photodetectors
- Discrimination topologies
- Topologies for Analog to Digital Converters (ADC) and Time to Digital Converters (TDC)
- Discrete (with off-the-shelf components) and integrated (ASIC) Realization
- ASIC Integration Technologies and Challenges
Day 4
The Transmit Channel
- Introduction of Light Sources
- Laser Diode Control Electronics
- Introduction and principles of Switch Components
- Switch Driver Electronics and the parasitics to be minimized
- EMC issues, Integration and Miniaturization
Day 5
Light Steering Methods, Power Management and Packaging
- MEMS Mirrors for Light Steering (technology, challenges, sensing and control electronics, ASIC)
- Optical Phased Arrays (OPA) and the role of Silicon Photonics
- Power Management Topologies for LiDAR (discrete and integrated)
- Electronic and Optoelectronic (Co-)Packaging and Hybrid Assembly
ALL COURSE DATES FOR THE CATEGORY: Automotive, Circuit & System Design, Sensors and Digital Imaging
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Read full course description including course schedule
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Part 1 – Introduction to Correlated and Uncorrelated Noise in Imagers
In the introduction of the course, the difference between Correlated and Uncorrelated Noise will be explained. In a first instance, one can put all fixed-pattern noise sources or noise in the spatial domain under the header of Correlated Noise, and one can put all temporal noise sources or noise in the time domain under the header of Uncorrelated Noise.
Part 2 – Characterization of Noise in Dark
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Part 3 – Characterization of Noise with Light
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Read full course description including course schedule.
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Location: E-Course 3 months access
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