Instructor: Dr. Ehrenfried Zschech
Expand your knowledge of the processing, materials, performance, and reliability aspects of heterogeneous integration of chiplets. Let Professor Zschech guide you all the way from 3D advanced packaging technologies through fault isolation and failure analysis up to the kinetics of degradation processes and reliability challenges. This course will include novel aspects of high-performance computing and AI applications that are driving the demand for increased functionality, performance, and reliability.
Location: Amersfoort, The Netherlands
Date: May 18 – May 20, 2026
Duration: 3 days
Reserve your seat today – booking confirmation sent by email.
Payment requested when the course is approved to run as planned.