Instructor: Dr. Jeffrey Gambino
This advanced 3-day course will provide a high-level overview of the packaging options for semiconductor devices. The course covers design considerations, packaging materials, assembly processes, yield, and reliability. The course is addressed to a broad audience and is not intended as a research review, although it will be taught at a high level and in many areas will require familiarity with the subject matter.
Location: Barcelona, Spain
Date: April 13 – April 15, 2026
Duration: 3 days
Reserve your seat today – booking confirmation sent by email.
Payment requested when the course is approved to run as planned.